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VisionPro HSi High Speed Offline 3D SPI

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VisionPro HSi High Speed Offline 3D SPI

Specification

Product.No :15
Name :VisionPro HSi High Speed Offline 3D SPI
Group :Equipment
Model : SPI Solder Paste Inspection / VisionPro HSi High Speed Offline 3D SPI

Contact

Company Information : ProfessTech
Contact : 085-3686999, 081-9094323
Email : contact@profess-tech.com


VisionPro HSi High Speed Offline 3D SPI


Description

VisionPro HSi is a high-speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® 10/11 Pro user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

Key Features & Benefits

  • Fully Automated Solder Paste Height/Volume Measurements
  • Color 3D Profiles of Measured Features
  • Windows 10/11 Pro OS
  • 3 Year, End-User Warranty with Technical Support
  • VisionPro PSI 3D Camera Assembly
  • Dell® PC and LCD Monitor
  • 20″ x 16″ Inspection Area
  • NIST Traceable Standard
  • Hardware/Software Reference and Online Help

VisionPro HSi Brochure (PDF)

Specification

Inspection Speed .33 Sec./FOV
Height Accuracy 1µm (0.04 mils)
Gauge R&R <<10% (+/- 40% Tolerance)
Z Resolution 0.20 µm (.008 mils)
Lateral Resolution (X-Y) 4µm (.15 mils)
Minimum Paste Deposit 51µm (2 Mils)

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